SMT series adhesives are designed to enhance solder joint reliability by reducing the possibility of cracking on CSP, BGA, Flip Chip and POP (package on package) solder joints, particularly in lead free applications.

SMT256 is applied to solder balls/bumps at the flux/paste dip station prior to component placement. SMT266 is jet applied onto the PCB solder pads prior to component placement.

During the reflow process this polymer adhesive removes metal oxide and allows the solder joint to form, also during reflow, a 3-D polymer network forms and encapsulates the individual solder joints. This technology avoids CTE mismatch issues found in traditional underfills by leaving air gaps between the individual solder joints.

This product has been fully tested, drop test results and thermal cycling show a significant improvement in solder joint/ball reliability.  SMT256 and SMT266 are RoHS certified and  are applied in assemblies using standard Lead Free Reflow Profiles.

Significantly improve your solder joint reliability

• SMT256-266 - Solder Joint Encapsulant Adhesive technology reduces solder joint fatigue failures.
• Implement in your design and manufacturing process by utilizing your existing SMT Line and dipping station or jet applicator.
• Tested and implemented on applications using lead free solders and lead free assembly process
• No PCB pre-bake required
• No additional cure cycle required
• 100% reworkable