Improve BGA solder ball/joint reliability with PLACE-N-BONDTM Underfilms.
Reels, Protective Bands/Reel Wraps, Cover Tape, Anti-Static Bags, Moisture Barrier Bags, Boxes, Dessicant, Humidity Indicator Cards
SMT256 and SMT266
Improve CSP, BGA, Flip Chip and POP solder joint reliability with SMT256 and SMT266.
Alltemated will provide a turn-key approach to acquiring your customized component needs.
Test Points & Jumper Wire
Alltemated manufactures and distributes test points and jumper wire world wide.