 | SMT256 and SMT266 Improve CSP, BGA, Flip Chip and POP solder joint reliability with SMT256 and SMT266. |
 | PLACE-N-BOND TM Improve BGA solder ball/joint reliability with PLACE-N-BONDTM Underfilms. |
 | AirPouch Void-Fill Void-fill air pillows offer many advantages over traditional packing materials because they are cleaner, lighter, more user-friendly, and they increase product visibility over EPS peanuts and paper. |
 | Carrier Tape Component Packaging for automated assembly. EIA compliant packaging for standard and custom components. Tape widths from 8mm to 200mm. Custom tapes designed to meet your specifications. |
 | Taping Supplies Reels, Protective Bands/Reel Wraps, Cover Tape, Anti-Static Bags, Moisture Barrier Bags, Boxes, Dessicant, Humidity Indicator Cards |
 | Customized/Turnkey Components Alltemated will provide a turn-key approach to acquiring your customized component needs. |
 | Test Points & Jumper Wire Alltemated manufactures and distributes test points and jumper wire world wide. |