SMT256 and SMT266
Improve CSP, BGA, Flip Chip and POP solder joint reliability with SMT256 and SMT266.
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Improve BGA solder ball/joint reliability with PLACE-N-BONDTM Underfilms.
Void-fill air pillows offer many advantages over traditional packing materials because they are cleaner, lighter, more user-friendly, and they increase product visibility over EPS peanuts and paper.
Component Packaging for automated assembly. EIA compliant packaging for standard and custom components. Tape widths from 8mm to 200mm. Custom tapes designed to meet your specifications.
Reels, Protective Bands/Reel Wraps, Cover Tape, Anti-Static Bags, Moisture Barrier Bags, Boxes, Dessicant, Humidity Indicator Cards
Alltemated will provide a turn-key approach to acquiring your customized component needs.
Test Points & Jumper Wire
Alltemated manufactures and distributes test points and jumper wire world wide.