PLACE-N-BOND^TM Pick and Place Underfilms

This Patented Partial Underfilm Technology uses thin solid thermoplastic films to edge or corner bond BGA/CSP packages to the PCB to improve solder Ball/Joint reliability.

This is accomplished by pick and placing the films onto the PCB prior to placement of the BGA/CSP.  The films are supplied in standard EIA-481 carrier tapes.  Utilizing existing feeders on existing SMT assembly lines, the films are placed during component placement.

The bonding and gap fill occurs during the reflow process, no secondary cure is required.  The films are geometrically precise and give you better volume and placement control over dispensed type systems.  This product also allows for the rework of the PCB assembly.

This product has been fully tested, drop test results show a significant improvement in solder joint/ball reliability.  PLACE-N-BOND^TM is RoHS certified and  is applied in assemblies using standard Lead Free Reflow Profiles.

Significantly improve your solder joint reliability

• PLACE-N-BOND^TM - Pick and Place Underfilm technology reduces solder joint fatigue failures.
• Implement in your design and manufacturing process by utilizing your existing SMT Line and existing tape and reel feeders.
• Tested and implemented on applications using lead free solders and lead free assembly process
• No equipment purchase or machine maintenance required
• No PCB pre-bake required
• No additional cure cycle required
• 100% reworkable

Click here for a Data Sheet - PLACE-N-BONDTM Underfilms