Carrier Tape 3196 North Kennicott Avenue
Arlington Heights, Illinois 60004		 TEL: 1-847-394-5800
FAX: 1-847-394-5805
Toll Free: 1-866-255-8362
 
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Since 1993, Alltemated has been the electronics industry's preferred choice for one-stop component-preparation services. Alltemated sets the standard for tape and reel packaging, IC programming, bake and dry-pack services and carrier tape manufacturing.

We provide turnkey engineered, documented and managed solutions for our global customer list of top distributors, EMS providers and OEM's. These top-tier companies depend on our proven quality and reliability.  

We pride ourselves on our commitment to quality, delivery and price. Our goal is total customer satisfaction. We provide aggressive same day service, on-demand capacity and superior performance every time.


 

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 PLACE-N-BOND Underfilms     

 PLACE-N-BOND Underfilm

Precision Designed Tape

Carrier Tape

Tape and Reel

Tape and Reel

IC Programming

IC Programming

AirPouch Void-Fill for Packaging

Void-Fill

Premium Cover Tape 

Contract Assembly

 Design and Assembly Services

Assembly Services

Plastic and Cardboard Reels

Tape and Reel

Barrier Bags

Custom Cable Assembly

Cable and Harness Assemblies

Cable and Harness Assemblies

Component Reclamation

Component Reclamation

Board Rework

Wire Harnless Assembly

 

Standard Carrier Tape Tool List

Carrier Tape Tool List
Featured Services Top Product
Tape and Reel
IC Programming
Cable and Harness Assembly
Custom Packaging
Design and Assembly Services
Carrier Tape
Taping Supplies
Test Points & Jumper Wire
Customized/Turnkey Components
PLACE-N-BOND Underfilm
AirPouch Void-Fill Systems

 
News
Alltemated Signs AirPouch Distribution Agreement - EarthAware Biodegradable Void-Fill

Alltemated, Inc. is now working with customers to install AirPouch Void-Fill Systems for protective packaging applications. This system offers eco-friendly EarthAware biodegradable pillows. For ESD concerns anti-static pillows are also available.

Void-Fillbio pillowsEarthAware

PLACE-N-BOND Underfilm - BGA Reliability Enhancement

TitleAlltemated launches line of PLACE-N-BONDTM Pick and Place Underfilms for BGA Solder Ball/Joint Reliabilty Enhancement.

Click here to get a Data Sheet

PLACE-N-BONDTM

Alltemated achieves ISO9001:2008 registration
To demonstrate our continuing commitment to quality, Alltemated is registered to the ISO9001:2008 Standard. Follow this link to see our certificate: ISO9001:2008Cert.pdf.
We Accept Credit Cards

Thumb - Payment Types

 

 

Alltemated is now set up to accept Credit Card payments.

Low and Medium Volume USB Duplication

 Thumb - Low and Medium USB Duplication

 

 

Alltemated, Inc is now equipped to handle your need for Low and Medium Volume USB Duplication.
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