PLACE-N-BOND Underfilm – BGA Reliability Enhancement
9 June 2015
Alltemated, Inc. announces the availability of PLACE-N-BONDTM Pick and Place Underfilms for Solder Joint/Ball Reliability. This Patented Partial Underfilm Technology uses thin solid Thermoplastic films at the edge or corner to bond packages to the PCB to improve solder Ball/Joint reliability.
This is accomplished by pick and placing the films onto the PCB prior to placement of the BGA/CSP. The films are supplied in standard EIA-481 carrier tapes. Utilizing existing feeders on existing SMT assembly lines, the films are placed during component placement. No special or additional equipment is required to implement this product into PCB assembly process.
The bonding and gap fill occurs during the reflow process, no secondary cure is required. The films are geometrically precise and give you better volume and placement control over dispensed type systems. This product also allows for the rework of the PCB assembly.
This product has been fully tested, drop test results show a significant improvement in solder joint/ball reliability. PLACE-N-BONDTM is RoHS certified and is applied in assemblies using standard Lead Free Reflow Profiles.